MINNEAPOLIS–(Organization WIRE)–CyberOptics® Corporation (NASDAQ: CYBE), a primary world-wide developer and company of significant-precision 3D sensing technological know-how alternatives, will characteristic the WX3000™ metrology and inspection procedure with Multi-Reflection Suppression™ (MRS) sensor know-how, and superior-precision sensors for semiconductor tool established-up and diagnostics at the Virtual SEMI Technological know-how Unites World wide Summit from February 15-19th.
Tim Skunes, VP of R&D at CyberOptics, will share a related technical presentation ‘Fast, 100% 3D Wafer Bump Metrology and Inspection to Enhance Yields and 3D Technique Integration’ on February 16th. Highly developed Packaging (AP) and wafer degree packaging (WLP) continue to be between the most dynamic and promptly evolving areas of semiconductor development and manufacturing. As the processes and attributes they produce have come to be smaller sized and a lot more advanced, companies experience an increasing have to have for significant-precision inspection and measurement to detect flaws and improve approach regulate. This need to have is amplified by the truth that these procedures use expensive acknowledged excellent die, creating the price tag of failure incredibly large.
The NanoResolution MRS sensor integrated into CyberOptics’ WX3000™ process gives sub-micrometer accuracy on options as compact as 25µm. Though retaining its capability to reject spurious multiple reflections, it adds the skill to seize and review specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing for remarkably exact inspection and 3D metrology of these vital packaging functions. Finish 100% 3D/2D inspection and bump metrology can be attained vs. time-consuming option procedures that call for separate scans for 3D and 2D, or a sampling only solution. With info processing speeds in excess of 75 million 3D details per 2nd, it provides output-deserving throughput higher than 25 wafers (300mm) per hour, at speeds 2-3X a lot quicker.
“Whether it’s for the back-end or mid-conclusion of the semiconductor fab, our proprietary sensors and units provide important added benefits to prospects in terms of enhanced yields, procedures and productiveness,” stated Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Compared to other remedies, our engineering saves our buyers significant time and expenditure.”
The business will also digitally exhibit higher-precision sensors that course of action and machines engineers use in the entrance-stop of the fab to velocity machines qualification, shorten products routine maintenance cycles, reduce devices charges and improve preventative upkeep options. The WaferSense® Auto Resistance Sensor™ (ARS) enables real-time resistance measurements of plating mobile contacts in semiconductor Electrochemical Deposition (ECD) programs, and the In-Line Particle Sensor™ (IPS) detects, displays and enables troubleshooting of particles down to .1 µm in fuel and vacuum traces in any regions of the fab 24/7.
The Technologies Unites Global Summit delivers with each other the world wide microelectronics provide chain, makers and close end users for a digital expertise showcasing field believed leaders and higher-price specialized articles from about the globe. CyberOptics is a platinum sponsor.
For a lot more facts, pay a visit to www.cyberoptics.com.
CyberOptics Company (www.cyberoptics.com) is a top world-wide developer and maker of high-precision 3D sensing technological innovation options. CyberOptics’ sensors are utilized for inspection and metrology in the SMT and semiconductor markets to considerably boost yields and productiveness. By leveraging its main edge systems, the Business has strategically established alone as a world-wide leader in superior precision 3D sensors, allowing for CyberOptics to further more increase its penetration of essential vertical marketplaces. Headquartered in Minneapolis, Minnesota, CyberOptics conducts all over the world functions through its services in North The us, Asia and Europe.
Statements with regards to the Company’s anticipated effectiveness are forward-wanting and for that reason include challenges and uncertainties, such as but not constrained to: a probable environment-broad recession or depression ensuing from the financial implications of the COVID-19 pandemic the unfavorable result on our revenue and working benefits of the COVID-19 crisis on our shoppers and suppliers and the worldwide provide chain industry conditions in the international SMT and semiconductor money machines industries trade relations concerning the United States and China and other countries the timing of orders and shipments of our items, especially our 3D MRS™ SQ3000 Multi-Perform systems™ and MX systems for memory module inspection raising rate competitiveness and price force on our item gross sales, specifically our SMT techniques the degree of orders from our OEM prospects the availability of pieces expected to meet up with shopper orders unanticipated products advancement troubles the effect of environment situations on our sales, the the greater part of which are from foreign prospects rapid improvements in technologies in the electronics and semiconductor marketplaces solution introductions and pricing by our rivals the accomplishment of our 3D technologies initiatives the sector acceptance of our SQ3000 MultiFunction™ inspection and measurement systems and products and solutions for semiconductor highly developed packaging inspection and metrology highly-priced and time consuming litigation with third events relevant to mental home infringement the damaging impression on our buyers and suppliers because of to previous and future terrorist threats and assaults and any functions of war the affect of the MX3000™ orders on our consolidated gross margin proportion in any future period challenges similar to cancellation or renegotiation of orders we have gained and other factors set forth in the Company’s filings with the Securities and Trade Commission.