Insights on the Semiconductor Packaging Worldwide Sector to 2027

Dublin, Jan. 15, 2021 (Globe NEWSWIRE) — The “Semiconductor Packaging – International Sector Trajectory &

Dublin, Jan. 15, 2021 (Globe NEWSWIRE) — The “Semiconductor Packaging – International Sector Trajectory & Analytics” report has been added to ResearchAndMarkets.com’s supplying.

The publisher delivers a long time of investigation practical experience to the 7th version of this report. The 290-page report offers concise insights into how the pandemic has impacted generation and the acquire side for 2020 and 2021. A limited-time period phased recovery by vital geography is also addressed.

International Semiconductor Packaging Marketplace to Attain $41.8 Billion by 2027

Amid the COVID-19 disaster, the world-wide market for Semiconductor Packaging estimated at US$26.7 Billion in the calendar year 2020, is projected to access a revised dimensions of US$41.8 Billion by 2027, growing at a CAGR of 6.6% in excess of the examination interval 2020-2027.

Natural substrates, a single of the segments analyzed in the report, is projected to history a 7.4% CAGR and attain US$22.3 Billion by the conclusion of the evaluation period. Soon after an early investigation of the enterprise implications of the pandemic and its induced economic disaster, expansion in the Guide frames section is readjusted to a revised 6.3% CAGR for the up coming 7-yr interval.

The U.S. Current market is Estimated at $7.2 Billion, While China is Forecast to Develop at 10.2% CAGR

The Semiconductor Packaging industry in the U.S. is approximated at US$7.2 Billion in the 12 months 2020. China, the world`s next biggest economic system, is forecast to get to a projected market place size of US$9.1 Billion by the calendar year 2027 trailing a CAGR of 10.2% about the examination period of time 2020 to 2027. Between the other noteworthy geographic marketplaces are Japan and Canada, every single forecast to expand at 3.5% and 6% respectively over the 2020-2027 period. In just Europe, Germany is forecast to improve at roughly 4.2% CAGR.

Bonding wires Phase to Record 5.8% CAGR

In the global Bonding wires segment, United states, Canada, Japan, China and Europe will generate the 5.3% CAGR believed for this section. These regional marketplaces accounting for a put together marketplace measurement of US$3 Billion in the yr 2020 will achieve a projected size of US$4.3 Billion by the near of the examination time period. China will continue being among the quickest developing in this cluster of regional marketplaces. Led by international locations these kinds of as Australia, India, and South Korea, the sector in Asia-Pacific is forecast to achieve US$5.7 Billion by the year 2027, although Latin The us will broaden at a 7% CAGR via the evaluation interval.

Opponents determined in this marketplace involve, among the other individuals:

  • Amkor Technological know-how, Inc.

  • ASE Group

  • Chipbond Technological innovation Company

  • ChipMOS Systems, Inc.

  • Fujitsu Ltd.

  • Intel Corporation

  • Interconnect Techniques, Inc.

  • Powertech Know-how, Inc.

  • Samsung Electronics Co., Ltd.

  • Siliconware Precision Industries Co., Ltd. (SPIL)

  • STATS ChipPAC Pte. Ltd.

  • Tianshui Huatian Technology Co., Ltd.

  • Unisem (M) Berhad

  • UTAC Holdings Ltd.

Key Matters Included:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. Govt SUMMARY

1. Industry OVERVIEW

  • Worldwide Competitor Marketplace Shares

  • Semiconductor Packaging Competitor Market place Share Situation All over the world (in %): 2019 & 2025

  • Effect of Covid-19 and a Looming World Economic downturn

2. Concentration ON Pick Gamers

3. Current market Traits & Motorists

4. World Current market Viewpoint

III. Market place Assessment

IV. Levels of competition

For a lot more information about this report check out https://www.researchandmarkets.com/r/ka847x

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